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1 Ergebnisse
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A Novel Conformal Thick Oxide Technology for On-Chip High-V..:
Lv, Guangfu
;
Ding, Yixiao
;
Fang, Xiangming
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12 (2022) 4 - p. 704-706 , 2022
Link:
https://doi.org/10.1109/tcpmt.2022.3160732
RT Journal T1 <Title>A Novel Conformal Thick Oxide Technology for On-Chip High-Voltage Isolation</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2022.3160732&Exemplar=1&LAN=DE A1 Lv, Guangfu A1 Ding, Yixiao A1 Fang, Xiangming A1 Li, Lisong A1 Bai, Feiming A1 Sin, Johnny K. O. A1 Wu, Rongxiang PB Institute of Electrical and Electronics Engineers (IEEE) YR 2022 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 12 IS 4 SP 704 OP 706 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2022.3160732 DO https://doi.org/10.1109/tcpmt.2022.3160732 SF ELIB - SuUB Bremen
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