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1 Ergebnisse
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Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) ..:
Yi, Hengqian
;
Ozturk, Efe
;
Koelink, Marco
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12 (2022) 6 - p. 893-901 , 2022
Link:
https://doi.org/10.1109/tcpmt.2022.3172618
RT Journal T1 <Title>Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2022.3172618&Exemplar=1&LAN=DE A1 Yi, Hengqian A1 Ozturk, Efe A1 Koelink, Marco A1 Krimmling, Jana A1 Damian, Andrei A. A1 Debski, Wojciech A1 van Zeijl, H. W. A1 Zhang, Guoqi A1 Poelma, Rene H. PB Institute of Electrical and Electronics Engineers (IEEE) YR 2022 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 12 IS 6 SP 893 OP 901 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2022.3172618 DO https://doi.org/10.1109/tcpmt.2022.3172618 SF ELIB - SuUB Bremen
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