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Thermal Modeling of a Chiplet-Based Packaging With a 2.5-D ..:

Zhou, Minghao ; Li, Li ; Hou, Fengze..
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  6 - p. 956-963 , 2022
Link: https://doi.org/10.1109/tcpmt.2022.3174608