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1 Ergebnisse
1
Design and Thermal Analysis of a 3-D Printed Impingement Pi..:
Hoang, Cong Hiep
;
Azizi, Arad
;
Fallahtafti, Najmeh
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12 (2022) 7 - p. 1091-1099 , 2022
Link:
https://doi.org/10.1109/tcpmt.2022.3185401
RT Journal T1 <Title>Design and Thermal Analysis of a 3-D Printed Impingement Pin Fin Cold Plate for Heterogeneous Integration Application</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2022.3185401&Exemplar=1&LAN=DE A1 Hoang, Cong Hiep A1 Azizi, Arad A1 Fallahtafti, Najmeh A1 Rangarajan, Srikanth A1 Radmard, Vahideh A1 Arvin, Charles A1 Sikka, Kamal A1 Schiffres, Scott A1 Sammakia, Bahgat PB Institute of Electrical and Electronics Engineers (IEEE) YR 2022 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 12 IS 7 SP 1091 OP 1099 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2022.3185401 DO https://doi.org/10.1109/tcpmt.2022.3185401 SF ELIB - SuUB Bremen
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