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Cardinal and Ordinal Directions Approach in Investigating A..:
Ismail, Adlil Aizat
;
Abu Bakar, Maria
;
Ehsan, Abang Annuar
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12 (2022) 9 - p. 1492-1501 , 2022
Link:
https://doi.org/10.1109/tcpmt.2022.3198406
RT Journal T1 <Title>Cardinal and Ordinal Directions Approach in Investigating Arrayed Solder Joints Crack Propagation of Ball Grid Array Semiconductor Packages</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2022.3198406&Exemplar=1&LAN=DE A1 Ismail, Adlil Aizat A1 Abu Bakar, Maria A1 Ehsan, Abang Annuar A1 Jalar, Azman A1 Basiron, Erwan A1 Ani, Fakhrozi Che PB Institute of Electrical and Electronics Engineers (IEEE) YR 2022 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 12 IS 9 SP 1492 OP 1501 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2022.3198406 DO https://doi.org/10.1109/tcpmt.2022.3198406 SF ELIB - SuUB Bremen
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