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1 Ergebnisse
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Comprehensive Investigation of In-Plane and Out-of-Plane Di..:
Ouyang, Guangqi
;
Hanna, Amir
;
Benedict, Samatha
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12 (2022) 10 - p. 1692-1701 , 2022
Link:
https://doi.org/10.1109/tcpmt.2022.3207031
RT Journal T1 <Title>Comprehensive Investigation of In-Plane and Out-of-Plane Die Shift in Flexible Fan-Out Wafer-Level Packaging Using Polydimethylsiloxane</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2022.3207031&Exemplar=1&LAN=DE A1 Ouyang, Guangqi A1 Hanna, Amir A1 Benedict, Samatha A1 Ezhilarasu, Goutham A1 Alam, Arsalan A1 Irwin, Randall W. A1 Iyer, Subramanian S. PB Institute of Electrical and Electronics Engineers (IEEE) YR 2022 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 12 IS 10 SP 1692 OP 1701 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2022.3207031 DO https://doi.org/10.1109/tcpmt.2022.3207031 SF ELIB - SuUB Bremen
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