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RF Waveguide Pattern Engineering to Mitigate Bonding Surfac..:
Boynton, Nicholas A.
;
Valdez, Forrest G.
;
Friedmann, Thomas A.
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12 (2022) 11 - p. 1729-1739 , 2022
Link:
https://doi.org/10.1109/tcpmt.2022.3217445
RT Journal T1 <Title>RF Waveguide Pattern Engineering to Mitigate Bonding Surface Nonuniformities in CMOS Compatible Fabrication Processes</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2022.3217445&Exemplar=1&LAN=DE A1 Boynton, Nicholas A. A1 Valdez, Forrest G. A1 Friedmann, Thomas A. A1 Arterburn, Shawn C. A1 Dallo, Christina M. A1 Pomerene, Andrew T. A1 Starbuck, Andrew L. A1 Trotter, Douglas C. A1 Gehl, Michael R. A1 DeRose, Christopher T. A1 Mookherjea, Shayan A1 Lentine, Anthony L. PB Institute of Electrical and Electronics Engineers (IEEE) YR 2022 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 12 IS 11 SP 1729 OP 1739 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2022.3217445 DO https://doi.org/10.1109/tcpmt.2022.3217445 SF ELIB - SuUB Bremen
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