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Ultrathin Glass-Based Wafer-Level Integration for Miniaturi..:

Huang, Yu-Ting ; Tsai, Yi-Chieh ; Huang, Yi-Cheng..
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  1 - p. 120-126 , 2023
Link: https://doi.org/10.1109/tcpmt.2022.3232339