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1 Ergebnisse
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Thermomechanical Oriented Reliability Enhancement of Si MOS..:
Jiang, Jing
;
Chen, Wei
;
Qian, Yichen
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13 (2023) 4 - p. 481-488 , 2023
Link:
https://doi.org/10.1109/tcpmt.2023.3267411
RT Journal T1 <Title>Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2023.3267411&Exemplar=1&LAN=DE A1 Jiang, Jing A1 Chen, Wei A1 Qian, Yichen A1 Meda, Abdulmelik H. A1 Fan, Xuejun A1 Zhang, Guoqi A1 Fan, Jiajie PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 13 IS 4 SP 481 OP 488 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2023.3267411 DO https://doi.org/10.1109/tcpmt.2023.3267411 SF ELIB - SuUB Bremen
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