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1 Ergebnisse
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Modeling of Practical Substrate Thickness in Multilayer Pri..:
Lee, Dongmin
;
Lee, Ahnwoo
;
Kim, Minchul
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13 (2023) 4 - p. 511-519 , 2023
Link:
https://doi.org/10.1109/tcpmt.2023.3267487
RT Journal T1 <Title>Modeling of Practical Substrate Thickness in Multilayer Printed Circuit Board for Millimeter-Wave Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2023.3267487&Exemplar=1&LAN=DE A1 Lee, Dongmin A1 Lee, Ahnwoo A1 Kim, Minchul A1 Choe, Wonseok A1 Lee, Chungsik A1 Yoon, Kwansun A1 Jeong, Mingeun A1 Kim, Junghyun PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 13 IS 4 SP 511 OP 519 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2023.3267487 DO https://doi.org/10.1109/tcpmt.2023.3267487 SF ELIB - SuUB Bremen
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