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Warpage Estimation and Demonstration of Panel-Level Fan-Out..:

Lee, Chang-Chun ; Chang, Che-Pei ; Chen, Chin-Yi..
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  4 - p. 560-569 , 2023
Link: https://doi.org/10.1109/tcpmt.2023.3269424