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1 Ergebnisse
1
SiC Microchannel Heat Sinks for High Heat Flux Dissipation ..:
Cassada, Nicole
;
Anderson, Caleb
;
Kubicek, London
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13 (2023) 5 - p. 655-665 , 2023
Link:
https://doi.org/10.1109/tcpmt.2023.3281772
RT Journal T1
SiC Microchannel Heat Sinks for High Heat Flux Dissipation of 1 kW/cm2
UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2023.3281772&Exemplar=1&LAN=DE A1 Cassada, Nicole A1 Anderson, Caleb A1 Kubicek, London A1 Hobby, David A1 Frye, Clint A1 Baxamusa, Salmaan A1 Kotovsky, Jack A1 Jackson, Kathy A1 Ladner, Ian A1 Bandhauer, Todd PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 13 IS 5 SP 655 OP 665 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2023.3281772 DO https://doi.org/10.1109/tcpmt.2023.3281772 SF ELIB - SuUB Bremen
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