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Revealing Hidden Defects in Electronic Components With an A..:
Weiss, E.
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13 (2023) 7 - p. 1078-1080 , 2023
Link:
https://doi.org/10.1109/tcpmt.2023.3293005
RT Journal T1 <Title>Revealing Hidden Defects in Electronic Components With an AI-Based Inspection Method: A Corrosion Case Study</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2023.3293005&Exemplar=1&LAN=DE A1 Weiss, E. PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 13 IS 7 SP 1078 OP 1080 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2023.3293005 DO https://doi.org/10.1109/tcpmt.2023.3293005 SF ELIB - SuUB Bremen
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