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1 Ergebnisse
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Reliability Improvement of Low-Temperature Sintered Nano-Si..:
Zhang, Bowen
;
Zhang, Shaoqiong
;
Lu, Xinyan
..
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13 (2023) 8 - p. 1209-1217 , 2023
Link:
https://doi.org/10.1109/tcpmt.2023.3299291
RT Journal T1 <Title>Reliability Improvement of Low-Temperature Sintered Nano-Silver as Die Attachment by Porosity Optimization</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2023.3299291&Exemplar=1&LAN=DE A1 Zhang, Bowen A1 Zhang, Shaoqiong A1 Lu, Xinyan A1 Han, Lili A1 Mei, Yun-Hui PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 13 IS 8 SP 1209 OP 1217 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2023.3299291 DO https://doi.org/10.1109/tcpmt.2023.3299291 SF ELIB - SuUB Bremen
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