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1 Ergebnisse
1
High Heat-Flux Removal From Topside-Cooled GaN Power Device..:
Ramaraju, Ramgopal Varma
;
Zaman, Mohammad Shawkat
;
Passandideh-Fard, Mohammad
..
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13 (2023) 8 - p. 1164-1173 , 2023
Link:
https://doi.org/10.1109/tcpmt.2023.3306706
RT Journal T1 <Title>High Heat-Flux Removal From Topside-Cooled GaN Power Devices by Water-Jet Impingement Using 3-D-Printed Nozzles</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2023.3306706&Exemplar=1&LAN=DE A1 Ramaraju, Ramgopal Varma A1 Zaman, Mohammad Shawkat A1 Passandideh-Fard, Mohammad A1 Trescases, Olivier A1 Chandra, Sanjeev PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 13 IS 8 SP 1164 OP 1173 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2023.3306706 DO https://doi.org/10.1109/tcpmt.2023.3306706 SF ELIB - SuUB Bremen
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