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Modeling of Laser Absorption and Modification Layer Formati..:
Lim, Dao Kun
;
Vempaty, Venkata Rama Satya Pradeep
;
Shah, Ankur Harish
..
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13 (2023) 9 - p. 1486-1493 , 2023
Link:
https://doi.org/10.1109/tcpmt.2023.3308923
RT Journal T1 <Title>Modeling of Laser Absorption and Modification Layer Formation Within Silicon Due to Stealth Dicing</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2023.3308923&Exemplar=1&LAN=DE A1 Lim, Dao Kun A1 Vempaty, Venkata Rama Satya Pradeep A1 Shah, Ankur Harish A1 Sim, Wen How A1 Singh, Harjashan Veer PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 13 IS 9 SP 1486 OP 1493 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2023.3308923 DO https://doi.org/10.1109/tcpmt.2023.3308923 SF ELIB - SuUB Bremen
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