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1 Ergebnisse
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Simplified Assembly of Through-Silicon-Via Integrated Ion T..:
Zhao, Peng
;
Li, Hong Yu
;
Likforman, Jean-Pierre
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13 (2023) 9 - p. 1337-1343 , 2023
Link:
https://doi.org/10.1109/tcpmt.2023.3309831
RT Journal T1 <Title>Simplified Assembly of Through-Silicon-Via Integrated Ion Traps</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2023.3309831&Exemplar=1&LAN=DE A1 Zhao, Peng A1 Li, Hong Yu A1 Likforman, Jean-Pierre A1 Henner, Theo A1 Lim, Yu Dian A1 Hu, Liang Xing A1 Seit, Wen Wei A1 Luca, Guidoni A1 Tan, Chuan Seng PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 13 IS 9 SP 1337 OP 1343 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2023.3309831 DO https://doi.org/10.1109/tcpmt.2023.3309831 SF ELIB - SuUB Bremen
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