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1 Ergebnisse
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Controlling Underfill on Die in Multichip Heterogenous Inte..:
Lin, Ziyin
;
Li, Wei
;
Cetegen, Edvin
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13 (2023) 9 - p. 1510-1515 , 2023
Link:
https://doi.org/10.1109/tcpmt.2023.3312037
RT Journal T1 <Title>Controlling Underfill on Die in Multichip Heterogenous Integration With Large Die Height Delta</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2023.3312037&Exemplar=1&LAN=DE A1 Lin, Ziyin A1 Li, Wei A1 Cetegen, Edvin A1 Guo, Yang A1 Liu, Nai-Yuan A1 Okafor, Ifeanyi A1 Mehta, Vipul A1 Brun, Xavier A1 Zhong, Shan A1 Li, Hsin-Yu A1 Rumer, Christopher PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 13 IS 9 SP 1510 OP 1515 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2023.3312037 DO https://doi.org/10.1109/tcpmt.2023.3312037 SF ELIB - SuUB Bremen
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