I agree that this site is using cookies. You can find further informations here.
X
Merkliste 
 1 Ergebnisse 
 
1

A Low-Loss Via-Free Ridge Air-Filled Substrate Integrated W..:

Ting, Cheng-Wu ; Liu, Hsu-Wei ; Liao, Chung-Hsing..
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  9 - p. 1451-1460 , 2023
Link: https://doi.org/10.1109/tcpmt.2023.3312139