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Reliability Improvement of 3.3 kV Full-SiC Power Modules fo..:

Yasui, Kan ; Hayakawa, Seiichi ; Funaki, Tsuyoshi
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  9 - p. 1476-1485 , 2023
Link: https://doi.org/10.1109/tcpmt.2023.3312281