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1 Ergebnisse
1
High-Temperature Constitutive Behavior of Electroplated Cop..:
Pan, Ke
;
Yang, Junbo
;
Lai, Yangyang
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13 (2023) 11 - p. 1861-1867 , 2023
Link:
https://doi.org/10.1109/tcpmt.2023.3322423
RT Journal T1 <Title>High-Temperature Constitutive Behavior of Electroplated Copper TGV Through Numerical Simulation</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2023.3322423&Exemplar=1&LAN=DE A1 Pan, Ke A1 Yang, Junbo A1 Lai, Yangyang A1 Park, Seungbae A1 Okoro, Chukwudi A1 Joshi, Dhananjay A1 Pollard, Scott PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 13 IS 11 SP 1861 OP 1867 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2023.3322423 DO https://doi.org/10.1109/tcpmt.2023.3322423 SF ELIB - SuUB Bremen
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