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1 Ergebnisse
1
Rapid Sintering and Nondestructive Testing of Nanometal Chi..:
Li, Xiandong
;
Xiong, Ding
;
Zheng, Weiyang
..
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13 (2023) 12 - p. 1905-1913 , 2023
Link:
https://doi.org/10.1109/tcpmt.2023.3336296
RT Journal T1 <Title>Rapid Sintering and Nondestructive Testing of Nanometal Chip Bonding Layer by Pulsed Current Discharge</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2023.3336296&Exemplar=1&LAN=DE A1 Li, Xiandong A1 Xiong, Ding A1 Zheng, Weiyang A1 Yu, Liang A1 Li, Jian PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 13 IS 12 SP 1905 OP 1913 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2023.3336296 DO https://doi.org/10.1109/tcpmt.2023.3336296 SF ELIB - SuUB Bremen
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