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1 Ergebnisse
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Electrothermal Reliability Analysis of Electromigration in ..:
Zhang, Yiming
;
Tian, Wenchao
;
Wang, Hongyue
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 14 (2024) 1 - p. 157-165 , 2024
Link:
https://doi.org/10.1109/tcpmt.2023.3343708
RT Journal T1 <Title>Electrothermal Reliability Analysis of Electromigration in 3-D TSV-RDL Interconnects</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2023.3343708&Exemplar=1&LAN=DE A1 Zhang, Yiming A1 Tian, Wenchao A1 Wang, Hongyue A1 Zhang, Xiaowen A1 Shao, Weiheng A1 Zhou, Bin A1 Shi, Yijun A1 Gong, Weixi A1 Deng, Rui A1 Zhao, Jianguo A1 Wang, Pan A1 Feng, Yang PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 14 IS 1 SP 157 OP 165 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2023.3343708 DO https://doi.org/10.1109/tcpmt.2023.3343708 SF ELIB - SuUB Bremen
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