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1 Ergebnisse
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Terahertz Nondestructive Characterization of Conformal Coat..:
Shi, Haolian
;
Calvelli, Serena
;
Zhai, Min
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 14 (2024) 1 - p. 3-9 , 2024
Link:
https://doi.org/10.1109/tcpmt.2023.3347298
RT Journal T1 <Title>Terahertz Nondestructive Characterization of Conformal Coatings for Microelectronics Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2023.3347298&Exemplar=1&LAN=DE A1 Shi, Haolian A1 Calvelli, Serena A1 Zhai, Min A1 Ricci, Marco A1 Laureti, Stefano A1 Singh, P. A1 Fu, H. A1 Locquet, Alexandre A1 Citrin, D. S. PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 14 IS 1 SP 3 OP 9 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2023.3347298 DO https://doi.org/10.1109/tcpmt.2023.3347298 SF ELIB - SuUB Bremen
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