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1 Ergebnisse
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A Laser-Assisted Thermal Gradient Transient Liquid Phase Bo..:
Hu, Shizun
;
Song, Jiaqi
;
Liu, Yu
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 14 (2024) 2 - p. 328-341 , 2024
Link:
https://doi.org/10.1109/tcpmt.2024.3355159
RT Journal T1 <Title>A Laser-Assisted Thermal Gradient Transient Liquid Phase Bonding Process Design for Thermally Sensitive Components in Hermetic Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2024.3355159&Exemplar=1&LAN=DE A1 Hu, Shizun A1 Song, Jiaqi A1 Liu, Yu A1 Wu, Chenran A1 Lei, Tianhao A1 Ge, Anxu A1 Zhang, Donglin A1 Zhao, Xiuchen A1 Huo, Yongjun A1 Lee, Chin C. PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 14 IS 2 SP 328 OP 341 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2024.3355159 DO https://doi.org/10.1109/tcpmt.2024.3355159 SF ELIB - SuUB Bremen
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