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1 Ergebnisse
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Electrical Characterization of Shielded TSVs With Airgap Is..:
Oh, Shane
;
Zheng, Ting
;
Bakir, Muhannad S.
IEEE Transactions on Components, Packaging and Manufacturing Technology. 14 (2024) 2 - p. 202-210 , 2024
Link:
https://doi.org/10.1109/tcpmt.2024.3358102
RT Journal T1 <Title>Electrical Characterization of Shielded TSVs With Airgap Isolation for RF/mmWave Applications</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2024.3358102&Exemplar=1&LAN=DE A1 Oh, Shane A1 Zheng, Ting A1 Bakir, Muhannad S. PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 14 IS 2 SP 202 OP 210 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2024.3358102 DO https://doi.org/10.1109/tcpmt.2024.3358102 SF ELIB - SuUB Bremen
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