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1 Ergebnisse
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Enhanced Heat Spreading Performance of Printed Circuit Boar..:
Yu, Jui-Cheng
;
Liao, Chien-Neng
;
Chang, Yu-Hsiang
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 14 (2024) 2 - p. 221-228 , 2024
Link:
https://doi.org/10.1109/tcpmt.2024.3358867
RT Journal T1 <Title>Enhanced Heat Spreading Performance of Printed Circuit Boards by Vapor Chamber Implementation</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2024.3358867&Exemplar=1&LAN=DE A1 Yu, Jui-Cheng A1 Liao, Chien-Neng A1 Chang, Yu-Hsiang A1 Huang, Hung-Hsien A1 Wang, Chen-Chao A1 Hung, Chin-Pin PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 14 IS 2 SP 221 OP 228 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2024.3358867 DO https://doi.org/10.1109/tcpmt.2024.3358867 SF ELIB - SuUB Bremen
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