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Study of Interaction Between Reflow Solder Flux and Humidit..:
Lakkaraju, Anish Rao
;
Conseil-Gudla, Helene
;
Ambat, Rajan
IEEE Transactions on Components, Packaging and Manufacturing Technology. 14 (2024) 3 - p. 510-518 , 2024
Link:
https://doi.org/10.1109/tcpmt.2024.3369076
RT Journal T1 <Title>Study of Interaction Between Reflow Solder Flux and Humidity in Relation to Failures in Electronics</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2024.3369076&Exemplar=1&LAN=DE A1 Lakkaraju, Anish Rao A1 Conseil-Gudla, Helene A1 Ambat, Rajan PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 14 IS 3 SP 510 OP 518 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2024.3369076 DO https://doi.org/10.1109/tcpmt.2024.3369076 SF ELIB - SuUB Bremen
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