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1 Ergebnisse
1
Two-Phase Liquid Cooling for High-Power Microelectronics vi..:
Feng, Huicheng
;
Tang, Gongyue
;
Zhang, Xiaowu
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 14 (2024) 3 - p. 397-405 , 2024
Link:
https://doi.org/10.1109/tcpmt.2024.3371390
RT Journal T1 <Title>Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2024.3371390&Exemplar=1&LAN=DE A1 Feng, Huicheng A1 Tang, Gongyue A1 Zhang, Xiaowu A1 Lau, Boon Long A1 Jong, Ming Chinq A1 Au, Keng Yuen Jason A1 Ong, Jun Wei Javier A1 Chui, King Jien A1 Li, Jun A1 Li, Hongying A1 Vinh Le, Duc A1 Lou, Jing PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 14 IS 3 SP 397 OP 405 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2024.3371390 DO https://doi.org/10.1109/tcpmt.2024.3371390 SF ELIB - SuUB Bremen
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