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1 Ergebnisse
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Two-Step Ar/N₂ Plasma Treatment on SiO₂ Surface for Cu/SiO₂..:
Park, Sangwoo
;
Lee, Sangmin
;
Kim, Sarah Eunkyung
IEEE Transactions on Components, Packaging and Manufacturing Technology. 14 (2024) 4 - p. 723-728 , 2024
Link:
https://doi.org/10.1109/tcpmt.2024.3379117
RT Journal T1 <Title>Two-Step Ar/N₂ Plasma Treatment on SiO₂ Surface for Cu/SiO₂ Hybrid Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2024.3379117&Exemplar=1&LAN=DE A1 Park, Sangwoo A1 Lee, Sangmin A1 Kim, Sarah Eunkyung PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 14 IS 4 SP 723 OP 728 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2024.3379117 DO https://doi.org/10.1109/tcpmt.2024.3379117 SF ELIB - SuUB Bremen
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