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Laser Rework Process for Efficient Lead-Free Solder Joints ..:
Ismail, Adlil Aizat
;
Abu Bakar, Maria
;
Jalar, Azman
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 14 (2024) 4 - p. 735-742 , 2024
Link:
https://doi.org/10.1109/tcpmt.2024.3379219
RT Journal T1 <Title>Laser Rework Process for Efficient Lead-Free Solder Joints Ball Grid Array (BGA) Component Rework</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2024.3379219&Exemplar=1&LAN=DE A1 Ismail, Adlil Aizat A1 Abu Bakar, Maria A1 Jalar, Azman A1 Zolkefli, Zol Effendi A1 Basiron, Erwan A1 Ilias, Muhammad Nizam PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 14 IS 4 SP 735 OP 742 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2024.3379219 DO https://doi.org/10.1109/tcpmt.2024.3379219 SF ELIB - SuUB Bremen
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