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1 Ergebnisse
1
Metrology of Silicon Wafers Through Synchrotron Section Top..:
Xin, Xiao
;
Gorji, Nima E.
;
Tseng, Ming-Lang
IEEE Transactions on Components, Packaging and Manufacturing Technology. 14 (2024) 7 - p. 1164-1171 , 2024
Link:
https://doi.org/10.1109/tcpmt.2024.3386069
RT Journal T1 <Title>Metrology of Silicon Wafers Through Synchrotron Section Topography and X-Ray Diffraction Imaging</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2024.3386069&Exemplar=1&LAN=DE A1 Xin, Xiao A1 Gorji, Nima E. A1 Tseng, Ming-Lang PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 14 IS 7 SP 1164 OP 1171 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2024.3386069 DO https://doi.org/10.1109/tcpmt.2024.3386069 SF ELIB - SuUB Bremen
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