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Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enab..:
Pfahler, Tim
;
Breun, Sascha
;
Engel, Lukas
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 14 (2024) 5 - p. 880-890 , 2024
Link:
https://doi.org/10.1109/tcpmt.2024.3386959
RT Journal T1 <Title>Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2024.3386959&Exemplar=1&LAN=DE A1 Pfahler, Tim A1 Breun, Sascha A1 Engel, Lukas A1 Geissler, Christian A1 Schür, Jan A1 Vossiek, Martin PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 14 IS 5 SP 880 OP 890 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2024.3386959 DO https://doi.org/10.1109/tcpmt.2024.3386959 SF ELIB - SuUB Bremen
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