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Ultrasonic Al Bond on Mo Back-Contact Layer of CIGS Solar P..:
Hamid, Sabarina Abdul
;
Zulkifli, Muhammad Nubli
;
Jalar, Azman
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 14 (2024) 6 - p. 1123-1133 , 2024
Link:
https://doi.org/10.1109/tcpmt.2024.3393917
RT Journal T1 <Title>Ultrasonic Al Bond on Mo Back-Contact Layer of CIGS Solar Panel Characterization Using Infinite Focus Microscope (IFM) and Micro-Ohmmeter</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2024.3393917&Exemplar=1&LAN=DE A1 Hamid, Sabarina Abdul A1 Zulkifli, Muhammad Nubli A1 Jalar, Azman A1 Jusoh, Wan Nursheila Wan A1 Bakar, Maria Abu A1 Basher, Hassan A1 Daenen, Michael PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 14 IS 6 SP 1123 OP 1133 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2024.3393917 DO https://doi.org/10.1109/tcpmt.2024.3393917 SF ELIB - SuUB Bremen
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