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1 Ergebnisse
1
Reliable WBG Devices Packaging by Forming Nano-gradient Str..:
Zhang, Bowen
;
Zhao, Zhiyuan
;
Liu, Yi
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. , 2024
Link:
https://doi.org/10.1109/tcpmt.2024.3394526
RT Journal T1
Reliable WBG Devices Packaging by Forming Nano-gradient Structures on Silver-plated Substrates
UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2024.3394526&Exemplar=1&LAN=DE A1 Zhang, Bowen A1 Zhao, Zhiyuan A1 Liu, Yi A1 Ma, Haoxiang A1 Shi, Chao A1 Mei, Yun-Hui PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology SP 1 OP 1 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2024.3394526 DO https://doi.org/10.1109/tcpmt.2024.3394526 SF ELIB - SuUB Bremen
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