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1 Ergebnisse
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Simulation and Experimental Verification of Moisture Diffus..:
Shi, Binjie
;
Su, Meiying
;
Ma, Rui
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 14 (2024) 6 - p. 1036-1042 , 2024
Link:
https://doi.org/10.1109/tcpmt.2024.3396996
RT Journal T1
Simulation and Experimental Verification of Moisture Diffusion in Embedded Component Packages
UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2024.3396996&Exemplar=1&LAN=DE A1 Shi, Binjie A1 Su, Meiying A1 Ma, Rui A1 Chen, Chuan A1 You, Xiangan A1 Ding, Fei A1 Wang, Qidong A1 Cao, Liqiang PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 14 IS 6 SP 1036 OP 1042 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2024.3396996 DO https://doi.org/10.1109/tcpmt.2024.3396996 SF ELIB - SuUB Bremen
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