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1 Ergebnisse
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Extending Copper Interconnects and Epoxy Dielectrics to Mul..:
Park, Junghyun
;
Xu, Jiayou
;
Engler, Anthony
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 14 (2024) 6 - p. 984-992 , 2024
Link:
https://doi.org/10.1109/tcpmt.2024.3399662
RT Journal T1 <Title>Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2024.3399662&Exemplar=1&LAN=DE A1 Park, Junghyun A1 Xu, Jiayou A1 Engler, Anthony A1 Williamson, Jaimal A1 Mathew, Varughese A1 Park, Sunggook A1 Flake, John C. PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology VO 14 IS 6 SP 984 OP 992 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2024.3399662 DO https://doi.org/10.1109/tcpmt.2024.3399662 SF ELIB - SuUB Bremen
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