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1 Ergebnisse
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Enhancing Board-Level Drop Impact Reliability through Epoxy..:
Noh, Taejoon
;
Jeong, Haksan
;
Jung, Seung-Boo
IEEE Transactions on Components, Packaging and Manufacturing Technology. , 2024
Link:
https://doi.org/10.1109/tcpmt.2024.3409753
RT Journal T1 <Title>Enhancing Board-Level Drop Impact Reliability through Epoxy-Based Underfill Modification</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2024.3409753&Exemplar=1&LAN=DE A1 Noh, Taejoon A1 Jeong, Haksan A1 Jung, Seung-Boo PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology SP 1 OP 1 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2024.3409753 DO https://doi.org/10.1109/tcpmt.2024.3409753 SF ELIB - SuUB Bremen
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