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1 Ergebnisse
1
Improved Electrothermal Properties and High-Frequency Disch..:
Wang, Wei
;
Li, Bei
;
Li, Sigeng
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. , 2024
Link:
https://doi.org/10.1109/tcpmt.2024.3410379
RT Journal T1
Improved Electrothermal Properties and High-Frequency Discharge Performance Verification of MWCNT/SiC Complex-Modified Silicone Gel
UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2024.3410379&Exemplar=1&LAN=DE A1 Wang, Wei A1 Li, Bei A1 Li, Sigeng A1 Wang, Xincheng A1 Gong, Yanfeng A1 Wang, Jian A1 Ren, Hanwen A1 Li, Qingmin PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology SP 1 OP 1 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2024.3410379 DO https://doi.org/10.1109/tcpmt.2024.3410379 SF ELIB - SuUB Bremen
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