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1 Ergebnisse
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Effect of Thermal & Mechanical Stresses on Novel Microstrip..:
Obeidat, Abdullah S.
;
Enkerakpo, Emuobosan
;
Umar, Ashraf
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. , 2024
Link:
https://doi.org/10.1109/tcpmt.2024.3412740
RT Journal T1
Effect of Thermal & Mechanical Stresses on Novel Microstrip Lines Printed on Flexible Substrates
UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2024.3412740&Exemplar=1&LAN=DE A1 Obeidat, Abdullah S. A1 Enkerakpo, Emuobosan A1 Umar, Ashraf A1 Al-Shaibani, Waleed A1 Abdelatty, Mohamed A1 Lieberman, Sara A1 Shamsian, Olya A1 Al-Haidari, Riadh A1 Alhendi, Mohammed A1 Poliks, Mark D. PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology SP 1 OP 1 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2024.3412740 DO https://doi.org/10.1109/tcpmt.2024.3412740 SF ELIB - SuUB Bremen
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