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1 Ergebnisse
1
Continuous Electroless Seed Layer Deposition in Through-Gla..:
Pawar, Karan
;
Pandey, Harsh
;
Dixit, Pradeep
IEEE Transactions on Components, Packaging and Manufacturing Technology. , 2024
Link:
https://doi.org/10.1109/tcpmt.2024.3419836
RT Journal T1 <Title>Continuous Electroless Seed Layer Deposition in Through-Glass-Vias by Ultrasonic Agitation</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2024.3419836&Exemplar=1&LAN=DE A1 Pawar, Karan A1 Pandey, Harsh A1 Dixit, Pradeep PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology SP 1 OP 1 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2024.3419836 DO https://doi.org/10.1109/tcpmt.2024.3419836 SF ELIB - SuUB Bremen
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