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1 Ergebnisse
1
Investigation of Heat Dissipation and Electrical Properties..:
Shi, Hutao
;
Cheng, Chunmin
;
Sun, Chao
...
IEEE Transactions on Components, Packaging and Manufacturing Technology. , 2024
Link:
https://doi.org/10.1109/tcpmt.2024.3435835
RT Journal T1 <Title>Investigation of Heat Dissipation and Electrical Properties of Diamond Interposer for 2.5-D Packagings</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tcpmt.2024.3435835&Exemplar=1&LAN=DE A1 Shi, Hutao A1 Cheng, Chunmin A1 Sun, Chao A1 Lei, Zhenyang A1 Wu, Gai A1 Li, Lijie A1 Liang, Kang A1 Shen, Wei A1 Liu, Sheng PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 2156-3950 SN 2156-3985 JF IEEE Transactions on Components, Packaging and Manufacturing Technology SP 1 OP 1 LK http://dx.doi.org/https://doi.org/10.1109/tcpmt.2024.3435835 DO https://doi.org/10.1109/tcpmt.2024.3435835 SF ELIB - SuUB Bremen
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