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Charge Transport Characteristics of Core-Shell SiC Filled E..:

Han, Yongsen ; Zhao, Chenguang ; Sun, Jian.
IEEE Transactions on Dielectrics and Electrical Insulation.  30 (2023)  6 - p. 2706-2713 , 2023
Link: https://doi.org/10.1109/tdei.2023.3289775