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Analysis of Hump Effect Induced by Positive Bias Temperatur..:

Hung, Wei-Chieh ; Jin, Fu-Yuan ; Chang, Ting-Chang...
IEEE Transactions on Device and Materials Reliability.  23 (2023)  2 - p. 263-268 , 2023
Link: https://doi.org/10.1109/tdmr.2023.3263868