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Improvement of Encapsulation Technique of Organic Photovolt..:

Cha, Hou-Chin ; Sung, Yun-Ming ; Yin, Ta-Chung...
IEEE Transactions on Device and Materials Reliability.  23 (2023)  2 - p. 281-286 , 2023
Link: https://doi.org/10.1109/tdmr.2023.3269443