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1 Ergebnisse
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Data-Driven Stress/Warpage Analyses Based on Stoney Equatio..:
Chen, Kuo-Shen
;
Wu, Wen-Chun
IEEE Transactions on Device and Materials Reliability. 24 (2024) 1 - p. 112-122 , 2024
Link:
https://doi.org/10.1109/tdmr.2024.3352001
RT Journal T1 <Title>Data-Driven Stress/Warpage Analyses Based on Stoney Equation for Packaging Applications</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tdmr.2024.3352001&Exemplar=1&LAN=DE A1 Chen, Kuo-Shen A1 Wu, Wen-Chun PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 1530-4388 SN 1558-2574 JF IEEE Transactions on Device and Materials Reliability VO 24 IS 1 SP 112 OP 122 LK http://dx.doi.org/https://doi.org/10.1109/tdmr.2024.3352001 DO https://doi.org/10.1109/tdmr.2024.3352001 SF ELIB - SuUB Bremen
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