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1 Ergebnisse
1
Buried Interconnects for Sub-5 nm SRAM Design:
Mathur, R.
;
Bhargava, M.
;
Cline, B.
...
IEEE Transactions on Electron Devices. 69 (2022) 3 - p. 1041-1047 , 2022
Link:
https://doi.org/10.1109/ted.2022.3143078
RT Journal T1 <Title>Buried Interconnects for Sub-5 nm SRAM Design</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_ted.2022.3143078&Exemplar=1&LAN=DE A1 Mathur, R. A1 Bhargava, M. A1 Cline, B. A1 Salahuddin, S. A1 Gupta, A. A1 Schuddinck, P. A1 Ryckaert, J. A1 Kulkarni, J. P. PB Institute of Electrical and Electronics Engineers (IEEE) YR 2022 SN 0018-9383 SN 1557-9646 JF IEEE Transactions on Electron Devices VO 69 IS 3 SP 1041 OP 1047 LK http://dx.doi.org/https://doi.org/10.1109/ted.2022.3143078 DO https://doi.org/10.1109/ted.2022.3143078 SF ELIB - SuUB Bremen
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