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1 Ergebnisse
1
A 3-D Thermal Network Model for Monitoring of IGBT Modules:
Heng, Ke
;
Yang, Xin
;
Wu, Xinlong
.
IEEE Transactions on Electron Devices. 70 (2023) 2 - p. 653-661 , 2023
Link:
https://doi.org/10.1109/ted.2022.3227004
RT Journal T1 <Title>A 3-D Thermal Network Model for Monitoring of IGBT Modules</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_ted.2022.3227004&Exemplar=1&LAN=DE A1 Heng, Ke A1 Yang, Xin A1 Wu, Xinlong A1 Ye, Junjie PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 0018-9383 SN 1557-9646 JF IEEE Transactions on Electron Devices VO 70 IS 2 SP 653 OP 661 LK http://dx.doi.org/https://doi.org/10.1109/ted.2022.3227004 DO https://doi.org/10.1109/ted.2022.3227004 SF ELIB - SuUB Bremen
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