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3-D Heterogeneous Integration of RRAM-Based Compute-In-Memo..:

Kaul, Ankit ; Luo, Yandong ; Peng, Xiaochen...
IEEE Transactions on Electron Devices.  70 (2023)  2 - p. 485-492 , 2023
Link: https://doi.org/10.1109/ted.2022.3231570