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1 Ergebnisse
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Toward Understanding Thickness Dependence on Dielectric Bre..:
Hu, Jia-Wei
;
Huang, Po-Chien
;
Huang, Pin-Wei
...
IEEE Transactions on Electron Devices. 70 (2023) 4 - p. 2175-2178 , 2023
Link:
https://doi.org/10.1109/ted.2023.3247553
RT Journal T1 <Title>Toward Understanding Thickness Dependence on Dielectric Breakdown Mechanism Under Forward Gate Bias in 4H-SiC MOS Technologies</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_ted.2023.3247553&Exemplar=1&LAN=DE A1 Hu, Jia-Wei A1 Huang, Po-Chien A1 Huang, Pin-Wei A1 Jiang, Jheng-Yi A1 Huang, Chih-Fang A1 Wu, Tian-Li PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 0018-9383 SN 1557-9646 JF IEEE Transactions on Electron Devices VO 70 IS 4 SP 2175 OP 2178 LK http://dx.doi.org/https://doi.org/10.1109/ted.2023.3247553 DO https://doi.org/10.1109/ted.2023.3247553 SF ELIB - SuUB Bremen
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